Semicon West gearing up for July


Jun 12, 2007

Promising everything related to designing and manufacturing semiconductors, nanoelectronics, and MEMS, Semicon West 2007 will run July 16-20 at San Francisco’s Moscone Center.

Highlights include the SEMI Test Summit and Reception on July 18 in which leaders of the premier semiconductor test companies will debate challenges facing their technology segment.

Similar issues will be covered on the Emerging Technologies and Markets TechXPOT Stage in five “shows-within-the-show” sessions over three days. Topics include “Nanomaterials and Tools Innovations,” “MEMS Manufacturing and Materials Technologies,” “Nanoelectronic and Nanoenergy Applications,” and “MEMS Applications and Business Models.”

Meanwhile, the Test, Assembly, and Packaging TechXPOT will focus on current trends and challenges in test, assembly, and packaging. And, technical presentations in the Challenges in Device Scaling TechXPOT will explore critical technologies enabling continued progress along the curve of Moore’s Law.
Besides the technical presentations, more than 200 new products will be introduced at Semicon West. For more information, visit

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