Semiconductor Manufacturing Processes and Laser Displacement Sensors

Jan. 28, 2010
Some common applications of laser displacement sensor, specifically when producing semiconductor wafers are noncontact thickness, flatness, perpendicularity and warpage.

One of the driving forces in the semiconductor manufacturing industry today is to reduce manufacturing cost and increase efficiency. In the past, laser displacement sensors have been used infrequently due to lack of speed, accuracy and flexibility. Recently, laser displacement sensors have become more accurate (0.02 μm repeatability), faster (392 kHz sampling rate) and more flexible. Because of their greater speed, accuracy and flexibility, these sensors can be used in a wider variety of applications ranging from wafer production and handling all the way to wire bonding and final packaging. Some common applications of laser displacement sensor, specifically when producing semiconductor wafers are noncontact thickness, flatness, perpendicularity and warpage.