MIPI Alliance updates CSI-2 Camera specification, expands to multiple platforms
April 10, 2017
MIPI CSI-2 v2.0 brings advanced imaging capabilities to a range of platforms like mobile devices to IoT, wearables, medical devices, drones and automotive systems
The MIPI Alliance has released MIPI CSI-2 v2.0, an update to its MIPI Camera Serial Interface (CSI-2) specification. The release expands the applicability to open up more opportunities for innovation on the architecture. According to MIPI, designers will be able to extend their product lines to target imaging and vision needs for mobile, the Internet of Things (IoT), wearables, medical, augmented and virtual reality, drones and automotive systems.
CSI-2 v2.0 can be implemented on either of two physical layers from MIPI Alliance: MIPI C-PHY and MIPI D-PHY. Both physical layer specifications have been updated to support the new CSI-2 v2.0, allowing designers to take advantage of the latest enhancements while supporting backwards compatibility.
MIPI CSI-2 v2.0 enhancements include:
RAW-16 and RAW-20 color depth that improves intra-scene High Dynamic Range (HDR) and Signal to Noise Ratio (SNR) to bring “advanced vision” capabilities to autonomous vehicles and systems
Expanded virtual channels from 4 to 32 to accommodate the proliferation of image sensors with multiple data types and support multi-exposure and multi-range sensor fusion for Advanced Driver Assistance Systems (ADAS) applications such as enhanced collision avoidance
Latency Reduction and Transport Efficiency (LRTE) provides increased image sensor aggregation without adding to system cost; facilitates real-time perception, processing and decision-making; and optimizes transport to reduce the number of wires, toggle rate and power consumption
Differential Pulse Code Modulation (DPCM) 12-10-12 compression, which reduces bandwidth while delivering superior SNR images devoid of compression artifacts for mission-critical vision applications
Scrambling to reduce Power Spectral Density (PSD) emissions, minimize radio interference and allow further reach for longer channels
Special considerations and requirements make packaging equipment an interesting vertical market unto itself. This new State of Technology Report from the editors of ...
This paper examines highly sensitive piezoelectric sensors for precise vibration measurement which is critical in semiconductor production to prevent quality and yield issues....
