Snap-UDC-HDB-G4 and Snap-UDC-HDB breakout boards boost the capabilities of 32-point Snap digital I/O modules, simplify field wiring and save panel space. The Snap-UDC-HDB-G4 breakout board allows connection of 32-point Snap digital I/O modules to higher loads to gain the reliability of fused outputs and isolated inputs, while the space-saving Snap-UDC-HDB breakout board provides spring-clamp connectors for as many as to 32 field devices, all in a small footprint. Both new breakout boards are part of the Snap PAC system, which includes PACs, Ethernet-based I/O systems and PAC Project automation software.