MIPI camera modules’ ultra-compact boards support the MIPI CSI-2 specification. They are available with different image sensors, including global shutter sensors and rolling shutter sensors. The modules contain mounting holes and precision fittings. A ceramic LGA chip helps ensure mechanical stability and accuracy. It is placed on a copper layer with edge metallization for optimal heat dissipation and minimal noise. The eight-layer board has a connector for a 22-pin flexprint cable, and the sensors can be triggered via this interface. The 200-mm flexprint cable included in delivery features a fully shielded backside and differential line pairs, ensuring noise-free MIPI transmission.
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