The Snap-UDC-HDB-G4 and Snap-UDC-HDB breakout boards are designed to boost the capabilities of 32-point Snap digital I/O modules, simplify field wiring and save panel space. With the Snap-UDC-HDB-G4 breakout board, OEMs, machine builders and automation professionals can connect 32-point Snap digital I/O modules to higher loads and gain the use of fused outputs and isolated inputs, while the space-saving Snap-UDC-HDB breakout board provides spring-clamp connectors for up to 32 field devices, all in a small footprint. Both boards are part of the Snap PAC System, which includes programmable automation controllers (PACs), Ethernet-based I/O systems and PAC Project automation software.
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