TDK FS160* μPOL dc-dc converter modules are designed to deliver exceptional power density and full telemetry in an ultra-compact footprint for space-constrained, high-performance applications. Measuring 3.3 x 3.3 x 1.35 mm, these modules integrate a controller, drivers, MOSFETs, logic core, inductor and additional passive components within a semiconductor-embedded package. This construction is designed to minimize parasitic inductance, enhance thermal efficiency and eliminate the need for wire bonds. The FS160* series spans output currents from 3 A to 25 A, scalable to 200 A via parallel configuration of up to eight FS1525. Each module provides real-time telemetry, including voltage, current and temperature, via an I²C interface, for intelligent system monitoring and predictive maintenance. The modules are engineered for easy integration with ASICs, SoCs and FPGAs. The μPOL modules are designed to simplify power management in applications like AI, machine learning, 5G, IoT, big data and enterprise computing. They operate across a -40 °C to +125 °C temperature range and are designed to perform with no airflow required for 15–30 W operation up to 100 °C ambient. The FS160* design supports both analog and digital configurations, with output voltages from 0.6 V to 5.0 V. Design support includes evaluation boards, SPICE simulation models and Ultra Librarian starter designs. Rated for industrial applications and ROHS compliant, the FS160* series kis designed to minimize PCB space, external components and overall system cost while delivering up to 1 Watt per mm³.
TDK / www.tdk.com
