Siemens’ PAVE360 digital twin environment, featuring Arm IP, applies high-fidelity modeling techniques from sensors and ICs to vehicle dynamics and the environment within which a vehicle operates. Using Arm IP, including Arm Automotive Enhanced (AE) products with functional safety support, digital twin models can run entire software stacks providing early metrics of power and performance while operating in the context of a high-fidelity model of the vehicle and its environment.
"Developing future transportation solutions requires collaboration across complex ecosystems,” said Dipti Vachani, senior vice president and general manager, automotive and IoT line of business for Arm. "Arm technology has been deployed in applications across the whole vehicle for more than two decades, and our collaboration with Siemens redefines what is possible in terms of safety-capable, scalable heterogeneous compute. We see this as an important catalyst for the next wave of automotive semiconductor innovation."
Using Siemens’ PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system on chip (SoC) designs before the vehicle is built. Arm’s automotive IP is helping the ability to create safety-enabled silicon, bringing it within reach of the entire automotive supply chain. According to Siemens, by rethinking IC design for the automotive industry, manufacturers can consolidate electronic control units (ECUs).
