FieldComm Group’s Strategic Integration Committee (SIC), composed of automation industry suppliers and standards development organizations (SDOs), has announced its official timeline for releasing the updated Field Device Integration (FDI) specification. This is designed to mark a step toward unifying device integration across process, hybrid and factory automation.
Following the transfer of FDT/DTM assets to FieldComm Group in 2024, the organization has accelerated its efforts toward unified device integration. The roadmap is a product of coordinated work by the SIC and specialized working groups. Comprised of board-level companies from FieldComm Group along with leaders from OPC Foundation, ODVA and Profibus & Profinet International (PI), the SIC has led the harmonization of FDI and FDT technologies. This collaboration aims to deliver a unified, intuitive and scalable device integration standard that addresses the evolving needs of manufacturing.
Key enhancements in the updated FDI specification:
- compliance, incorporating the requirements of the Cyber Resilience Act (CRA)
- unified device integration standard for process and factory automation
- support for legacy systems, enabling modernization without infrastructure replacement
- real-time OT/IT connectivity through a common information model (PA-DIM)
- support for platforms and development tools
- intelligent device and lifecycle management with protocol tunneling support, also known as nested communications.
FDI specification timeline for migration:
- end of 2026: release of the updated FDI specification
- end of 2027: deployment of the updated FDI Developer Toolkit
- 2029: market availability of registered FDI-enabled systems and devices.
"Today’s industrial systems are more complex than ever, yet this complexity must not compromise interoperability," said Steve Biegacki, chair of the SIC and former managing director of the FDT Group. "Our goal is to deliver a unified device integration solution that enhances data interoperability with OT/IT systems while supporting innovative features for modern manufacturing. This approach also provides a practical migration path, safeguarding existing investments and preparing the industry for future advancements."
Stefan Hoppe, president of the OPC Foundation, added: “As a co-owner of the FDI specification, the OPC Foundation is committed to robust and interoperable device integration for OPC UA users and fully supports the harmonization of FDI and FDT technologies to achieve this goal.”
Al Beydoun, president and executive director of ODVA, said: “ODVA is pleased to support the harmonization of FDI and FDT technologies to enable enhanced device integration interoperability for users of EtherNet/IP.”
Dietmar Bohn, executive director of PI, added: “PI appreciates that the FieldComm Group initiated the valuable discussions to determine the need for merging FDI and FDT, taking into account the needs of interested companies, as well as the technologies of the four participating standards development associations.”
This update is designed to enable manufacturers to transition toward more intelligent, responsive operations, unlocking the full value of industrial data and modern automation architectures.
