AI data-center power density could inspire standardized IEC infrastructures

Siemens and Rittal partner to design next-generation ‘sidecar’ power rack to deliver power in the data center white space

March 20, 2026

3 min read

The collaboration between Siemens and Rittal is set to extend to other industries and applications, made possible by coordinated components from the two companies.

Siemens and Rittal have entered a strategic partnership to jointly develop future-proof, sustainable products for more efficient data-center power distribution. The standardized infrastructure is intended to accelerate the construction of high-performance data centers, minimize time-to-compute and address the rapidly increasing power densities of AI applications.

In AI data centers, power densities exceeding 100 kW per rack have become the norm. By 2030, the power density could increase to more than 1 MW. This requires innovative architecture for power distribution, cooling and heat recovery. To address this, Siemens Smart Infrastructure, an international technology provider, is partnering with Friedhelm Loh Group and its largest company Rittal, a global supplier of racks and standardized infrastructure, including power and cooling for hyperscalers.

Figure 1: Prof. Dr. Friedhelm Loh, owner and CEO of the Friedhelm Loh Group.

“We have a long-standing collaboration with Siemens in a number of fields. We are proud to be taking our partnership to the next level,” said Prof. Dr. Friedhelm Loh, owner and CEO of the Friedhelm Loh Group (Figure 1). “Both companies are driven by the desire to innovate. As technology leaders, we have a responsibility to keep strengthening our customers' competitiveness with the latest technologies.”

One of the first joint products will be a “sidecar” application that is housed directly in the white space of a data center, where the server cabinets and data storage are located. By bundling the power electronics in a dedicated power rack that supplies the server racks, this type of power supply could represent an innovation for future AI applications by providing computing units with a fast, simple, standardized and scalable supply of power. Open Compute Project (OCP) standards and the modular solution with tested technology from Rittal and Siemens are designed to ensure fast deployment, high availability, reliable operation and maximized tokens-per-watt. These are the prerequisites for quickly bringing these relevant technologies to the digital economy.

Figure 2: Andreas Matthé, CEO, electrical products, at Siemens Smart Infrastructure.

“To enable the rapid growth of AI, we need smart, reliable and scalable power supply solutions for data centers and we need them quickly. In combination with our innovative electrical products and solutions, Rittal is an ideal partner when it comes to speed and standardization in infrastructure,” said Andreas Matthé, CEO, electrical products, at Siemens Smart Infrastructure (Figure 2).

Other Siemens and Rittal projects include the development of a standardized low-voltage distribution system for modular and containerized data centers, as well as optimized products for operational and personal safety. The first customer projects are already underway.

These data center applications are made possible by the coordinated components from Siemens and the power distribution platforms RiLineX and Ri4Power from Rittal Energy & Power Solutions.

The collaboration between Siemens and Rittal is set to extend to other industries and applications in the future. New applications are made possible by the coordinated components from Siemens and the power distribution platforms from Rittal.